| 姓 名 | 李喜德 | 性 别 | 男 | 出生年月 |
|---|---|---|---|---|
| 所在院校 | 清华大学 | 所在院系 | 航天航空学院 | |
| 职称 | 教授 | 招生专业 | 固体力学 | |
| 研究领域 | 微/纳米力学,先进力学实验科学,智能材料与结构的力学,航空航天结构与材料,光学与激光计量 |
| 联系方式 | lixide@tsinghua.edu.cn | 电 话 | 010-******* | 邮 编 | 100084 | |
|---|---|---|---|---|---|---|
| 地 址 | 北京清华大学逸夫科技楼3403 |
| 个人简介 |
个人简历: 个人简历: |
| 获得奖项 |
| 先后获得了包括国防预研二等奖、国家基金委优秀结题等多项学术奖励和荣誉。 先后获得了包括国防预研二等奖、国家基金委优秀结题等多项学术奖励和荣誉。 |
| 著作及论文 |
| 1. Microoptical metrology in China, Optics and Lasers in Engineering, 43(8),833-904,2005. Edited by Xide Li et al. Elsevier LTd. 2. Xide Li, Yan Yang, Cheng Wei. Exprimental investigation of polycrystalline material deformation based on a grain scale. Chin. Phys. Lett. 22(10): 2553-2556 (2005) 3. Xide Li, Cheng Wei, Yan Yang. Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method, Optics and Lasers in Engineering, 43(8): 869-884 (2005). 4. Xide Li, Cheng Wei. Real-time and Full-field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers. Key Engineering Materials, Vol.306-308: 1289-1294 (2005). 5. Xide Li, Ye Gu, A new positioning and loading system for the study of the mechanical behavior of small and micro components, SPIE, 5852, 264-269 (2005) 6. Xide Li, Chen Wei, Optical full-field technique for measuring deformation on micromechnaical components, SPIE, 5852, 321-327 (2005). 1. Microoptical metrology in China, Optics and Lasers in Engineering, 43(8),833-904,2005. Edited by Xide Li et al. Elsevier LTd. 2. Xide Li, Yan Yang, Cheng Wei. Exprimental investigation of polycrystalline material deformation based on a grain scale. Chin. Phys. Lett. 22(10): 2553-2556 (2005) 3. Xide Li, Cheng Wei, Yan Yang. Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method, Optics and Lasers in Engineering, 43(8): 869-884 (2005). 4. Xide Li, Cheng Wei. Real-time and Full-field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers. Key Engineering Materials, Vol.306-308: 1289-1294 (2005). 5. Xide Li, Ye Gu, A new positioning and loading system for the study of the mechanical behavior of small and micro components, SPIE, 5852, 264-269 (2005) 6. Xide Li, Chen Wei, Optical full-field technique for measuring deformation on micromechnaical components, SPIE, 5852, 321-327 (2005). |
| 承担项目 |
| 科研项目: 介观实验力学技术研究 微尺度与多场耦合实验检测技术及应用 基于晶粒尺度的多晶材料变形分析 微纳米散斑技术及其在MEMS器件热失效中的应用 科研项目: 介观实验力学技术研究 微尺度与多场耦合实验检测技术及应用 基于晶粒尺度的多晶材料变形分析 微纳米散斑技术及其在MEMS器件热失效中的应用 |