| 姓 名 | 钱乙余 | 性 别 | 男 | 出生年月 |
|---|---|---|---|---|
| 所在院校 | 哈尔滨工业大学 | 所在院系 | 材料加工工程 | |
| 职称 | 教授 | 招生专业 | 材料加工工程 | |
| 研究领域 | 钎焊、扩散焊、微连接及微电子焊接等 |
| 联系方式 | qianyiyu@hope.hit.edu.cn | 电 话 | 0451******* | 邮 编 | 0 | |
|---|---|---|---|---|---|---|
| 地 址 |
| 个人简介 |
| 1955-1960年：毕业于哈尔滨工业大学焊接专业获学士学位 1985-1989年：哈尔滨工业大学金属材料及工艺系副教授 1989-目前：哈尔滨工业大学金属材料及工艺系教授 1985-目前：哈尔滨工业大学材料加工工程学科硕士生导师 1993-目前：哈尔滨工业大学材料加工工程学科博士生导师 中国电子学会生产技术学会 副理事长 中国焊接学会 常务理事 中国焊接学会钎焊专业委员会 主 任 中国焊接标准化技术委员会钎焊分委员会 主 任 美国焊接学会（AWS） 成 员 曾兼任哈尔滨市人大常委会常委 南岗区人大常委会副主任 现兼任全国政协第九界委员会委员 哈尔滨市政协副主席 1955-1960年：毕业于哈尔滨工业大学焊接专业获学士学位 1985-1989年：哈尔滨工业大学金属材料及工艺系副教授 1989-目前：哈尔滨工业大学金属材料及工艺系教授 1985-目前：哈尔滨工业大学材料加工工程学科硕士生导师 1993-目前：哈尔滨工业大学材料加工工程学科博士生导师 中国电子学会生产技术学会 副理事长 中国焊接学会 常务理事 中国焊接学会钎焊专业委员会 主 任 中国焊接标准化技术委员会钎焊分委员会 主 任 美国焊接学会（AWS） 成 员 曾兼任哈尔滨市人大常委会常委 南岗区人大常委会副主任 现兼任全国政协第九界委员会委员 哈尔滨市政协副主席 |
| 著作及论文 |
| 1. Y.Y. Qian, X. Ma and F. Yoshida. The Stress Field Characteristics in the Surface Mount Solder Joints under Temperature Cycling: Temperature Effect and Its Evaluation. Welding Journal, 2002, (6): 85s-89s 2. Qian Yiyu, Dong Zhangui, Gao Feng. Microstructure development and metallurgical analysis of Al-Si contact reaction. Journal of materials process technology. 2002, 122(2/3): 305-308 3. Qian Yiyu, Dong Zhangui, Ma Xin. Penetrating behavior of eutectic liquid during Al/Cu contact reactive brazing. Trans. Nonferrous Met. Soc. China, 2001, 11(5): 664-666 4. Z.-S.Yu, Y.Y.Qian, M.-F.Wu. Interfacial distribution of elements and fracture behaviour analysis of metal inert gas brazed joint with copper based joint with copper based filler metals. Materials Science and Technology, 2002, 18(9): 1045-1048 5. Xin Ma, Yiyu Qian, Fusahito Yoshida. Strengthening Sn60-Pb40 solder alloy by adding trace amount of La. Materials Letters, 2002, 52: 319-322 6. Xin Ma, Yiyu Qian, F.Yoshida. Effect of La on the Sn-rich halo formation in Sn60-Pb40 alloy. Journal of Alloys and Compounds, 2001, 327(1/2): 263-266 7. Ma Xin, Qian Yiyu, Yoshida F. Finite Element Simulation of Mechanical Response of Solder Joints in Surface Mount Package Under Different Temperature Cycling Profile. Trans. Nonferrous Met. Soc. China, 2001, 11(4): 471-474 8. Ma Xin, Qian Yiyu, Yoshida F. Relative Damage Stress and Its Application in the Case of Temperature Cycling Load. Progress in Natural Science, 2001, 11(2):156-160 9. Xin Ma, Yiyu Qian, Hongyuan Fang and F. Yoshida. Relative Damage Stress: Dominant Mechanical Factor for the Failure of Solder Joints under Temperature ... 1. Y.Y. Qian, X. Ma and F. Yoshida. The Stress Field Characteristics in the Surface Mount Solder Joints under Temperature Cycling: Temperature Effect and Its Evaluation. Welding Journal, 2002, (6): 85s-89s 2. Qian Yiyu, Dong Zhangui, Gao Feng. Microstructure development and metallurgical analysis of Al-Si contact reaction. Journal of materials process technology. 2002, 122(2/3): 305-308 3. Qian Yiyu, Dong Zhangui, Ma Xin. Penetrating behavior of eutectic liquid during Al/Cu contact reactive brazing. Trans. Nonferrous Met. Soc. China, 2001, 11(5): 664-666 4. Z.-S.Yu, Y.Y.Qian, M.-F.Wu. Interfacial distribution of elements and fracture behaviour analysis of metal inert gas brazed joint with copper based joint with copper based filler metals. Materials Science and Technology, 2002, 18(9): 1045-1048 5. Xin Ma, Yiyu Qian, Fusahito Yoshida. Strengthening Sn60-Pb40 solder alloy by adding trace amount of La. Materials Letters, 2002, 52: 319-322 6. Xin Ma, Yiyu Qian, F.Yoshida. Effect of La on the Sn-rich halo formation in Sn60-Pb40 alloy. Journal of Alloys and Compounds, 2001, 327(1/2): 263-266 7. Ma Xin, Qian Yiyu, Yoshida F. Finite Element Simulation of Mechanical Response of Solder Joints in Surface Mount Package Under Different Temperature Cycling Profile. Trans. Nonferrous Met. Soc. China, 2001, 11(4): 471-474 8. Ma Xin, Qian Yiyu, Yoshida F. Relative Damage Stress and Its Application in the Case of Temperature Cycling Load. Progress in Natural Science, 2001, 11(2):156-160 9. Xin Ma, Yiyu Qian, Hongyuan Fang and F. Yoshida. Relative Damage Stress: Dominant Mechanical Factor for the Failure of Solder Joints under Temperature Cycling. Journal of Materials Science and Technology, 2001, 17(1):193-194 10. 激光软钎焊用高可靠性钎料膏的研制. 航天部三等奖. 1998 |